ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,983, issued on Sept. 16, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).
"Semiconductor package" was invented by Shu-Ting Lai (Taichung, Taiwan), Chiu-Lien Li (Taichung, Taiwan), Che-Min Su (Taichung, Taiwan), Chun-Huan Hung (Taichung, Taiwan), Mu-Hung Hsieh (Taichung, Taiwan), Cheng-Han Yao (Taichung, Taiwan), Fajanilan Darcyjo Directo (Taichung, Taiwan) and Cheng-Liang Hsu (Taichung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A carrier structure is provided with a plurality of package substrates connected via connecting sections, and a functional element and a groove are formed on the connecting section, s...