US Patent Issued to SILICONWARE PRECISION INDUSTRIES on Oct. 7 for "Electronic package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,094, issued on Oct. 7, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).

"Electronic package and manufacturing method thereof" was invented by Yi-Min Fu (Taichung, Taiwan), Chi-Ching Ho (Taichung, Taiwan), Chao-Chiang Pu (Taichung, Taiwan) and Yu-Po Wang (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided, in which an electronic module and at least one support member are disposed on a substrate structure having a circuit layer, such that the stress on the substrate structure is dispersed through the at least one support member to eliminate the problem of stress concentration a...