US Patent Issued to SILICONWARE PRECISION INDUSTRIES on Oct. 7 for "Electronic package and manufacturing method thereof, and antenna module and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,266, issued on Oct. 7, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).

"Electronic package and manufacturing method thereof, and antenna module and manufacturing method thereof" was invented by Shao-Tzu Tang (Taichung, Taiwan), Chih-Hsien Chiu (Taichung, Taiwan), Wen-Jung Tsai (Taichung, Taiwan), Ko-Wei Chang (Taichung, Taiwan) and Chia-Chu Lai (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An antenna module is provided with a plurality of antenna structures and a shielding structure arranged on a plate body, and the shielding structure is located between two adjacent antenna structures, where the shiel...