US Patent Issued to SILICONWARE PRECISION INDUSTRIES on Oct. 21 for "Electronic package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,416, issued on Oct. 21, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).

"Electronic package and manufacturing method thereof" was invented by Jun-Hao Feng (Taichung, Taiwan) and You-Chen Lin (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided, in which a conductive structure and a reinforced insulation portion are bonded to a dielectric layer, and the reinforced insulation portion is in contact with and abuts against the conductive structure, such that the reinforced insulation portion can support the conductive structure to prevent the conductive structure from cracking wh...