ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,774, issued on Nov. 11, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).
"Electronic package and substrate structure thereof" was invented by Yuan-Chang Ni (Taichung, Taiwan), Yu-Cheng Pai (Taichung, Taiwan), Yuan-Ping Yeh (Taichung, Taiwan), Chan-Yu Yeh (Taichung, Taiwan) and Meng-Jou He (Taichung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package and a substrate structure thereof are provided, in which a circuit layer and a filling layer are formed on a substrate body in the substrate structure, where the circuit layer has a plurality of conductive traces separated from each other, so that the...