US Patent Issued to SILICONWARE PRECISION INDUSTRIES on May 6 for "Electronic package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,952, issued on May 6, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).

"Electronic package and manufacturing method thereof" was invented by Ho-Chuan Lin (Taichung, Taiwan), Min-Han Chuang (Taichung, Taiwan) and Chia-Chu Lai (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the ele...