ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,308, issued on May 20, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).
"Electronic package" was invented by Sung-Hua Chung (Taichung, Taiwan) and Liang-Pin Chen (Taichung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided, in which an electronic structure is embedded in an encapsulation layer, a protective layer is formed on the encapsulation layer, an insulating layer is formed on the protective layer, and at least one blind via is formed penetrating through the insulating layer and the protective layer, so that the electronic structure is exposed from the blind via to make a circu...