US Patent Issued to SILICONWARE PRECISION INDUSTRIES on March 18 for "Electronic package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,182, issued on March 18, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).

"Electronic package and manufacturing method thereof" was invented by Meng-Huan Chia (Taichung, Taiwan), Yih-Jenn Jiang (Taichung, Taiwan), Chang-Fu Lin (Taichung, Taiwan) and Don-Son Jiang (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided, in which a first electronic element and a second electronic element are disposed on a first side of a circuit structure and a second side of the circuit structure, respectively, where a first metal layer is formed between the first side of the circuit structure a...