US Patent Issued to SILICONWARE PRECISION INDUSTRIES on March 18 for "Electronic package and carrier thereof and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,165, issued on March 18, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).

"Electronic package and carrier thereof and method for manufacturing the same" was invented by Chi-Ren Chen (Taichung, Taiwan), Po-Yung Chang (Taichung, Taiwan), Pei-Geng Weng (Taichung, Taiwan), Yuan-Hung Hsu (Taichung, Taiwan), Chang-Fu Lin (Taichung, Taiwan) and Don-Son Jiang (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided and includes a carrier for carrying electronic components. Electrical contact pads of the carrier for planting solder balls are connected with a plurality of columnar conduct...