ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,456, issued on June 17, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).
"Electronic package and manufacturing method thereof" was invented by Chung-Yu Ke (Taichung, Taiwan) and Liang-Pin Chen (Taichung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided, in which a plurality of antenna structures and a heat sink are integrated on a package module including an electronic element, so as to guide the heat energy generated by the electronic element out of the package module via the heat sink. Therefore, when the electronic package is configured with the plurality of antenna structures, t...