ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,425, issued on June 17, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).
"Electronic package and manufacturing method thereof" was invented by Ho-Chuan Lin (Taichung, Taiwan), Chia-Chu Lai (Taichung, Taiwan) and Min-Han Chuang (Taichung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided, in which a mesh structure is disposed between a circuit structure and an electronic element to increase the shunt path of current. Therefore, when the electronic element is used as an electrode pad of a power contact, the current can be passed through a conductive sheet of the circuit structure via t...