US Patent Issued to SILICONWARE PRECISION INDUSTRIES on June 17 for "Electronic package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,452, issued on June 17, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).

"Electronic package and manufacturing method thereof" was invented by Chao-Chiang Pu (Taichung, Taiwan), Chi-Ching Ho (Taichung, Taiwan), Yi-Min Fu (Taichung, Taiwan), Yu-Po Wang (Taichung, Taiwan) and Fang-Lin Tsai (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided and includes an electronic structure and a plurality of conductive pillars embedded in a cladding layer, a circuit structure formed on the cladding layer, and a reinforcing member bonded to a side surface of the cladding layer, where a plur...