US Patent Issued to Siliconware Precision Industries on July 22 for "Electronic package comprising conductive layer connected electrode pad through electronic component" (Taiwanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,081, issued on July 22, was assigned to Siliconware Precision Industries Co. Ltd. (Taichung, Taiwan).

"Electronic package comprising conductive layer connected electrode pad through electronic component" was invented by Ho-Chuan Lin (Taichung, Taiwan), Min-Han Chuang (Taichung, Taiwan) and Chia-Chu Lai (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connect...