US Patent Issued to Siliconware Precision Industries on July 22 for "Electronic package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,116, issued on July 22, was assigned to Siliconware Precision Industries Co. Ltd. (Taichung, Taiwan).

"Electronic package and manufacturing method thereof" was invented by Feng Kao (Taichung, Taiwan) and Lung-Yuan Wang (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided, in which an electronic element that is electrically connected to a plurality of conductive vias and a functional part that has a hollow area are disposed on a photonic die that has the plurality of conductive vias and at least one external connection portion, where a cladding layer covers the electronic element and the functional part, ...