US Patent Issued to SILICONWARE PRECISION INDUSTRIES on July 15 for "Electronic package and method of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,263, issued on July 15, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).

"Electronic package and method of fabricating the same" was invented by Pin-Jing Su (Taichung, Taiwan) and Cheng-Kai Chang (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided. The electronic package includes an encapsulating layer encapsulating a plurality of conductive pillars and an interposer board that has through-silicon vias. An electronic component is disposed on the encapsulating layer and electrically connected to the conductive pillars and the through-silicon vias. The conductive pillars act a...