US Patent Issued to SILICONWARE PRECISION INDUSTRIES on Jan. 20 for "Electronic package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,745, issued on Jan. 20, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).

"Electronic package and manufacturing method thereof" was invented by Wen-Jung Tsai (Taichung, Taiwan), Chih-Hsien Chiu (Taichung, Taiwan), Chien-Cheng Lin (Taichung, Taiwan), Ming-Fan Tsai (Taichung, Taiwan), Cheng-You Jeng (Taichung, Taiwan) and Hui-Jing Chang (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package and a manufacturing method thereof are provided, in which a cover is disposed on a carrier structure having an electronic element, and the electronic element is covered by the cover. A magnetic conductive ...