US Patent Issued to SILICONWARE PRECISION INDUSTRIES on Jan. 13 for "Electronic package of two vertically stacked chips with chip-to-chip bump connections and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,505, issued on Jan. 13, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).

"Electronic package of two vertically stacked chips with chip-to-chip bump connections and manufacturing method thereof" was invented by Yi-Min Fu (Taichung, Taiwan), Chi-Ching Ho (Taichung, Taiwan) and Yu-Po Wang (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided, where a laterally diffused metal oxide semiconductor (LDMOS) type electronic structure is mounted onto a complementary metal oxide semiconductor (CMOS) type electronic element to be integrated into a chip module, thereby shortening electrica...