ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,524, issued on Jan. 13, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).
"Electronic package" was invented by Ching-Chih Lin (Taichung, Taiwan), Wen-Hsin Wang (Taichung, Taiwan), Chieh-Yi Hsieh (Taichung, Taiwan), Shin-Yu Wang (Taichung, Taiwan), Yi-Chien Huang (Taichung, Taiwan) and Hsiu-Fang Chien (Taichung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided, in which an electronic element is arranged on a carrier structure having a plurality of wire-bonding pads arranged on a surface of the carrier structure, and a plurality of bonding wires are connected to a plurality of electrod...