ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,526,912, issued on Jan. 13, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).
"Carrier structure" was invented by Chien-Sheng Chen (Taichung, Taiwan), Chia-Chu Lai (Taichung, Taiwan) and Ho-Chuan Lin (Taichung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A carrier structure is provided, in which a ground layer is formed on a dielectric body, a circuit layer is formed in the dielectric body, and a conductive via is formed in the dielectric body and electrically connected to the circuit layer and the ground layer, where the ground layer has at least one first groove that exposes a surface of the dielectric body, so th...