US Patent Issued to Siliconware Precision Industries on Feb. 11 for "Electronic package including lead frame having multiple conductive posts" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 12 -- United States Patent no. 12,224,255, issued on Feb. 11, was assigned to Siliconware Precision Industries Co. Ltd. (Taichung, Taiwan).

"Electronic package including lead frame having multiple conductive posts" was invented by Chih-Hsien Chiu (Taichung, Taiwan) and Wen-Jung Tsai (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating po...