ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,460, issued on Dec. 9, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).
"Electronic package and manufacturing method thereof" was invented by Chung-Yu Ke (Taichung, Taiwan) and Liang-Pin Chen (Taichung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided, in which an electronic module and a plurality of conductive pillars are embedded in an encapsulation layer, and a circuit structure is formed on the encapsulation layer, where the electronic module includes a carrier structure having conductive vias and at least a first electronic element disposed on the carrier structure. The first el...