US Patent Issued to SILICONWARE PRECISION INDUSTRIES on Dec. 16 for "Electronic package including an interposer stacked on an electronic element and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,131, issued on Dec. 16, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).

"Electronic package including an interposer stacked on an electronic element and manufacturing method thereof" was invented by Chih-Hsien Chiu (Taichung, Taiwan), Wen-Jung Tsai (Taichung, Taiwan), Ko-Wei Chang (Taichung, Taiwan) and Chien-Cheng Lin (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided, in which an electronic element is disposed on a carrier structure, and an interposer is stacked on the electronic element. Further, a wire is connected to the interposer and grounds the carrier structure, s...