US Patent Issued to SILICONWARE PRECISION INDUSTRIES on Dec. 16 for "Electronic package having multi-chip package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,159, issued on Dec. 16, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).

"Electronic package having multi-chip package structure" was invented by Li-Chu Chang (Taichung, Taiwan), Yuan-Hung Hsu (Taichung, Taiwan) and Don-Son Jiang (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing an electronic package is provided and includes disposing a circuit member and a plurality of electronic elements on opposite sides of a carrier structure having circuit layers respectively, so that any two of the plurality of electronic elements can be electrically connected to each other via the circuit l...