US Patent Issued to SILICONWARE PRECISION INDUSTRIES on Dec. 16 for "Electronic package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,181, issued on Dec. 16, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).

"Electronic package and manufacturing method thereof" was invented by Chih-Hsien Chiu (Taichung, Taiwan), Wen-Jung Tsai (Taichung, Taiwan), Chih-Chiang He (Taichung, Taiwan), Ko-Wei Chang (Taichung, Taiwan) and Chia-Yang Chen (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided, in which electronic elements and at least one packaging module including a semiconductor chip and a shielding structure covering the semiconductor chip are disposed on a carrier structure, an encapsulation layer encapsulates the ...