US Patent Issued to SILICONWARE PRECISION INDUSTRIES on Aug. 26 for "Electronic package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,931, issued on Aug. 26, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).

"Electronic package and manufacturing method thereof" was invented by Yu-Lung Huang (Taichung, Taiwan), Chih-Ming Huang (Taichung, Taiwan), Kuo-Hua Yu (Taichung, Taiwan) and Chang-Fu Lin (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package, in which a heat dissipation structure is disposed on a carrier structure to form a packaging space for electronic components to be accommodated in the packaging space, and the electronic components are completely encapsulated by a heat dissipation material to prevent the electron...