US Patent Issued to SILICONWARE PRECISION INDUSTRIES on Aug. 12 for "Electronic package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,062, issued on Aug. 12, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).

"Electronic package and manufacturing method thereof" was invented by Wen-Jung Tsai (Taichung, Taiwan), Chih-Hsien Chiu (Taichung, Taiwan), Chin-Chiang He (Taichung, Taiwan), Ko-Wei Chang (Taichung, Taiwan) and Chien-Cheng Lin (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided and includes at least one electronic element, at least one first conductive structure and a second conductive structure disposed on one side of a carrier structure with at least one circuit layer, and an encapsulation layer cover...