US Patent Issued to SILICONWARE PRECISION INDUSTRIES on April 15 for "Electronic package and substrate structure thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,173, issued on April 15, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).

"Electronic package and substrate structure thereof" was invented by Wen-Chen Hsieh (Taichung, Taiwan), Ya-Ting Chi (Taichung, Taiwan), Chia-Wen Tsao (Taichung, Taiwan), Hsin-Yin Chang (Taichung, Taiwan), Yi-Lin Tsai (Taichung, Taiwan) and Hsiu-Fang Chien (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided and includes a substrate structure, an electronic element disposed on the substrate structure and an encapsulation layer encapsulating the electronic element, where at least one functional circuit is ...