ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,704, issued on Jan. 28, was assigned to Siliconix Inc. (San Jose, Calif.).
"Semiconductor package having side wall plating" was invented by Barry Lin (Kaohsiung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Methods are disclosed herein for forming wettable flanks on quad flat no-leads semiconductor packages. The methods may begin with a package assembly having multiple non-singulated packages. The package assembly includes a lead frame assembly having dies coupled thereto. A mold encapsulation covers the dies and exposes portions of leads. An electroplating step deposits plating on the exposed portions of the leads. First and second series ...