ALEXANDRIA, Va., June 17 -- United States Patent no. 12,313,673, issued on May 27, was assigned to Silicon Laboratories Inc. (Austin, Texas).
"WLCSP device enclosure" was invented by Wenshui Zhang (Singapore), Chee Teong Chang (Singapore) and Paul Ashley Nathan (Singapore).
According to the abstract* released by the U.S. Patent & Trademark Office: "A device enclosure for a wafer level chip scale package (WLCSP) device that is particularly useful for package qualification testing includes a base for receiving the WLCSP device and a removable cover. The device enclosure allows testing to occur without handling of the device. The base has through holes in a center portion of a bottom of the base to allow electrical contacts of the WLCSP devi...