US Patent Issued to SILICON FUTURE MANUFACTURING on Sept. 9 for "Probe card and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,411,156, issued on Sept. 9, was assigned to SILICON FUTURE MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Probe card and manufacturing method thereof" was invented by Chia-Hsiang Yu (Hsinchu, Taiwan), You-Chen Lin (Hsinchu, Taiwan), Neng-Kan Chu (Hsinchu, Taiwan), Heng-Rui Chang (Hsinchu, Taiwan), Tien-Chia Lee (Hsinchu, Taiwan) and Wen-Tsung Sung (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosure provides a probe card comprising a circuit substrate, a space transformer, and a first coaxial cable. The circuit substrate has a first surface and a second surface, wherein a through hole penetrates the circuit substrate from the ...