US Patent Issued to SILICON FUTURE MANUFACTURING on Nov. 18 for "Probe head and vertical probe card comprising the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,474,374, issued on Nov. 18, was assigned to SILICON FUTURE MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Probe head and vertical probe card comprising the same" was invented by Wen-Tsung Sung (Hsinchu, Taiwan), Tien-Chia Lee (Hsinchu, Taiwan) and Chia-Hsiang Yu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a probe head, comprising: an upper guide plate with a first through hole; a lower guide plate with a second through hole; and a probe structure body with a first end portion, a second end portion and a needle body. The upper guide plate and the lower guide plate jointly define an inner accommodation sp...