US Patent Issued to Silergy Semiconductor Technology (Hangzhou) on Oct. 7 for "Package structure for power converter and manufacture method thereof" (Chinese Inventor)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,066, issued on Oct. 7, was assigned to Silergy Semiconductor Technology (Hangzhou) LTD (Hangzhou, China).

"Package structure for power converter and manufacture method thereof" was invented by Jiaming Ye (Hangzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure of a power converter, can include: a die pad; an insulation adhesive layer and a conductive adhesive layer on the die pad; a control circuit die on the insulation adhesive layer, where the insulation adhesive layer comprises a first insulation adhesive layer on a back surface of the control circuit die, and a second insulation adhesive on a surface of the die pad, whe...