US Patent Issued to SIKA TECHNOLOGY on Oct. 7 for "Safer dustless method for installing a precompressed expansion joint sealing system" (American, Canadian Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,435,506, issued on Oct. 7, was assigned to SIKA TECHNOLOGY AG (Baar, Switzerland).

"Safer dustless method for installing a precompressed expansion joint sealing system" was invented by Lester Hensley (Westborough, Mass.), Massimo Demarco (Woodbridge, Canada) and Eric Muench (Fanwood, N.J.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a safer, dustless method for installing an expansion joint sealing system without mechanically grinding substrates to improve adhesion. The method includes locating substrates forming a gap between opposing surfaces of the substrates, preparing the surfaces by wiping with a solvent, and applying a mounting band...