ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,565, issued on Oct. 7, was assigned to Siemens AG (Munich).
"Heat sink assembly and power converter assembly" was invented by Roman Kogler (Nuremberg, Germany), Lutz Namyslo (Hausen, Germany) and Thomas Schwinn (Herzogenaurach, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat sink assembly for semiconductor components includes a first and second heat sinks, each having a component and cooling fin side, which is provided with cooling fins arranged one behind another such that a cooling medium initially flows in a flow direction through cooling channels formed by the cooling fins of the first heat sink and subsequently flows through coolin...