US Patent Issued to Siemens on Oct. 14 for "Semiconductor component with damped bonding surfaces in a package with encapsulated pins" (German Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,671, issued on Oct. 14, was assigned to Siemens AG (Munich).

"Semiconductor component with damped bonding surfaces in a package with encapsulated pins" was invented by Bernd Kurten (Obermichelbach, Germany) and Daniel Kappauf (Grafenberg, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A housing part for accommodating a semiconductor element includes a pin partially molded in the housing part for electrical connection to a printed circuit board. The pin includes a bonding surface for producing an electrical connection between the pin and the semiconductor element. The housing part includes a bearing surface for the bonding surface and a reces...