US Patent Issued to Siemens on Nov. 25 for "Arrangement for a semiconductor arrangement comprising at least one passive component and a substrate" (German Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,739, issued on Nov. 25, was assigned to Siemens AG (Munich).

"Arrangement for a semiconductor arrangement comprising at least one passive component and a substrate" was invented by Markus Lasch (Munich), Roland Lorz (Rottenbach, Germany), Markus Pfeifer (Nuremberg, Germany), Stefan Stegmeier (Munich), Erik Weisbrod (Munich), Ronny Werner (Nuremberg, Germany) and Felix Zeyss (Erlangen, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "An arrangement for a semiconductor arrangement includes a substrate including a dielectric material layer and a first metallization arranged on the dielectric material layer. A passive component is arranged complet...