US Patent Issued to Siemens on Jan. 27 for "Semiconductor assembly comprising a first semiconductor element and a first connection element" (German Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,801, issued on Jan. 27, was assigned to Siemens AG (Munich).

"Semiconductor assembly comprising a first semiconductor element and a first connection element" was invented by Vladimir Danov (Erlangen, Germany), Philipp Kneissl (Nuremberg, Germany), Volker Muller (Nuremberg, Germany), Stephan Neugebauer (Erlangen, Germany) and Florian Schwarz (Furth, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor assembly includes a semiconductor element designed as a power semiconductor module and comprising a contact, and a connection element designed as a busbar which is connected to the contact of the power semiconductor module via a force-...