US Patent Issued to Siemens Medical Solutions USA on July 29 for "Chip-on-array with interposer for a multidimensional transducer array" (Washington Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,370,576, issued on July 29, was assigned to Siemens Medical Solutions USA Inc. (Malvern, Pa.).

"Chip-on-array with interposer for a multidimensional transducer array" was invented by Baik Woo Lee (Issaquah, Wash.) and Stephen R. Barnes (Bellevue, Wash.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a chip-on-array approach, acoustic and electronic modules are separately formed. The acoustic stack is connected to one interposer, and the electronics are connected to another interposer. Different connection processes (e.g., using low temperature bonding for the acoustic stack and higher temperature-based interconnect for the electronics) may be used. Th...