US Patent Issued to Siemens Industry Software on Dec. 30 for "Wafer image denoising and contour extraction for manufacturing process calibration" (Belgian, American, Indian Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,511,773, issued on Dec. 30, was assigned to Siemens Industry Software Inc. (Plano, Texas).

"Wafer image denoising and contour extraction for manufacturing process calibration" was invented by Germain Louis Fenger (Gladstone, Ore.), Mark Pereira (Bengaluru, India), Bhamidipati Venkata Rama Samir (Bengaluru, India), Sandip Halder (Bierbeek, Belgium), Bappaditya Dey (Heverlee, Belgium), Hsin-Wei Wu (Heverlee, Belgium) and Kiarash Ahi (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "This application discloses a computing system to obtain a wafer image of an electronic device having physical structures manufactured using one or more lithograp...