US Patent Issued to SICK IVP on Oct. 7 for "Provision of real world and image sensor correspondence points for use in calibration of an imaging system for three dimensional imaging based on light triangulation" (Swedish Inventor)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,024, issued on Oct. 7, was assigned to SICK IVP AB (Linkoping, Sweden).

"Provision of real world and image sensor correspondence points for use in calibration of an imaging system for three dimensional imaging based on light triangulation" was invented by Daniel Rydstrom (Linkoping, Sweden).

According to the abstract* released by the U.S. Patent & Trademark Office: "Method and device(s) for provision of a pair of real world and image sensor correspondence points for use in calibration of an imaging system (405) for three dimensional imaging based on light triangulation. Said real world point (514-1; 529-1) being provided (801) as a first virtual intersection between a first real w...