US Patent Issued to SHOEI CHEMICAL on June 17 for "Semiconductor nanoparticle aggregate, semiconductor nanoparticle aggregate dispersion liquid, semiconductor nanoparticle aggregate composition, and semiconductor nanoparticle aggregate cured film" (Japanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,331,238, issued on June 17, was assigned to SHOEI CHEMICAL INC. (Tokyo).

"Semiconductor nanoparticle aggregate, semiconductor nanoparticle aggregate dispersion liquid, semiconductor nanoparticle aggregate composition, and semiconductor nanoparticle aggregate cured film" was invented by Naoki Umeda (Tosu, Japan), Takafumi Moriyama (Tosu, Japan), Hirokazu Sasaki (Tosu, Japan) and Keisuke Matsuura (Tosu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor nanoparticle aggregate that is an aggregate of core/shell type semiconductor nanoparticles including a core including In anda shell having one or more layers, in which a peak wavelength o...