US Patent Issued to SHINRYO on April 29 for "Low melting-point bonding member, method for producing same, semiconductor electronic circuit, and method for mounting said semiconductor electronic circuit" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,285,823, issued on April 29, was assigned to SHINRYO Corp. (Kitakyushu, Japan).

"Low melting-point bonding member, method for producing same, semiconductor electronic circuit, and method for mounting said semiconductor electronic circuit" was invented by Hirotoshi Nishi (Kitakyushu, Japan), Takeshi Sawai (Kitakyushu, Japan), Kenichirou Shirokawa (Kitakyushu, Japan) and Souichirou Omae (Kitakyushu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A low melting-point bonding member includes a low melting-point alloy containing Bi: 46 mass % or more and 72 mass % or less, In: 26 mass % or more and 54 mass % or less, and Sn: 2 mass % or less when a total...