ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,819, issued on Sept. 30, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).
"Substrate fixing device" was invented by Akihiro Kuribayashi (Nagano, Japan) and Riku Nishikawa (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate fixing device includes: an electrostatic chuck that is configured to adsorb and retain an object thereon, and including a base body on which the object is mounted, and an electrostatic electrode that is provided in the base body; and a base plate on which the electrostatic chuck is mounted, and having a plurality of through holes each exposing a first face of the base body facing the base...