US Patent Issued to SHINKO ELECTRIC INDUSTRIES on Sept. 30 for "Built-in component board, method of manufacturing the built-in component board" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,434, issued on Sept. 30, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).

"Built-in component board, method of manufacturing the built-in component board" was invented by Takashi Kasuga (Nagano, Japan), Takashi Sato (Nagano, Japan) and Yasuyuki Yamaguchi (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A built-in component board includes a first insulating layer; wiring layer and a metal pad layer that are formed on the first insulating layer; a second insulating layer that is formed on the wiring layer and the metal pad layer; and a cavity that is formed on the second insulating layer and that exposes the metal pad...