ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,418,984, issued on Sept. 16, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).
"Wiring board and semiconductor device" was invented by Masahiro Murakami (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board includes an interconnect structure. The interconnect structure includes a pad, an insulating layer covering the pad, a magnetic resin disposed on the pad in the insulating layer, and a via interconnect penetrating the magnetic resin and electrically connected to the pad."
The patent was filed on Sept. 27, 2022, under Application No. 17/935,634.
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