ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,418,981, issued on Sept. 16, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).
"Wiring board" was invented by Hikaru Tanaka (Nagano, Japan), Takashi Kasuga (Nagano, Japan), Tomoyuki Shimodaira (Nagano, Japan) and Hitoshi Kondo (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board includes a pad configured to make an external electrical connection, and an insulating layer. A portion of a lower surface of the pad is covered with the insulating layer. The pad includes a base portion, and an extending portion formed integrally with the base portion and extending toward an outer periphery of a side surface of the ba...