US Patent Issued to SHINKO ELECTRIC INDUSTRIES on Oct. 21 for "Interconnect substrate including substrates and connector disposed in recess" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,631, issued on Oct. 21, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).

"Interconnect substrate including substrates and connector disposed in recess" was invented by Atsuto Yoda (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interconnect substrate includes a first interconnect substrate having a first electrode on a first surface and having a recess formed in an edge in a plan view normal to the first surface, a second interconnect substrate having a second electrode on a second surface facing toward the first surface, a connector disposed inside the recess and electrically connected to the first interconnect ...