US Patent Issued to SHINKO ELECTRIC INDUSTRIES on Nov. 4 for "Wiring board assembly, wiring board, and wiring board manufacturing method" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,101, issued on Nov. 4, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).

"Wiring board assembly, wiring board, and wiring board manufacturing method" was invented by Yu Karasawa (Nagano, Japan) and Ryo Miyazawa (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board assembly includes a wiring structure and an insulating layer. The insulating layer covers a surface of the wiring structure and includes a slit that exposes a predetermined region on the surface of the wiring structure. An edge portion of the outermost insulating layer corresponding to the edge portion of the slit meanders in a wave-like manner."

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