US Patent Issued to SHINKO ELECTRIC INDUSTRIES on Nov. 4 for "Interconnect substrate with layers constituting stripline and semiconductor apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,131, issued on Nov. 4, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).

"Interconnect substrate with layers constituting stripline and semiconductor apparatus" was invented by Takashi Nakajima (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interconnect substrate includes a first interconnect layer, a first insulating layer covering a side surface and a lower surface of the first interconnect layer, a second insulating layer disposed on the first insulating layer and covering an upper surface of the first interconnect layer, a second interconnect layer formed on a lower surface of the first insulating layer, and a...