ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,691, issued on Nov. 25, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).
"Substrate fixing device" was invented by Masahiro Sunohara (Nagano, Japan) and Riku Nishikawa (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate fixing device includes a base plate, a ceramic plate, and a thermal conduction member. The ceramic plate is bonded to the base plate via an adhesive layer, and has an electrode embedded therein for generating heat, and configured to adsorb a substrate by electrostatic force. The thermal conduction member is arranged in at least one of an adhesive surface of the ceramic plate, an adhesive surf...